GraSen Technology maintains 3 qualified semiconductor foundries, on-shore and off-shore, to ensure a manufacturing capability that can meet any small-to-large volume commercial or military requirement while maintaining a low overhead structure.
GraSen Technology’s HBT and HFET products are available off-the-shelf (OTS) to 8 weeks (for unpackaged chip components), OTS to 14 weeks (for packaged amplifiers). Our surface-mount packaged products are lead-free and RoHS-compliant.
Our design services branch, GraSen Engineering, provides contract design and transfer services for customers needing Complementary Metal Oxide Semiconductor (CMOS) RF power amplifier or high-speed logic circuits, RF amplifier assembly, Multi-Chip Module (MCM), Monolithic Microwave Integrated Component (MMIC) or Microwave Integrated Circuit (MIC) capability for their own proprietary needs. Mechanical housing and packaging design services are also available.