Thermal Conductive Bonding Inc. was formed in 1998. TCB experts, both engineers and management, have decades of collective experience in providing bonding solutions to the high-technology community. Since its inception, in record time, TCB has become a recognized leader in joining materials with both Elastomer and Indium bonding systems.
TCB's ongoing R&D programs have enabled the company to lead the competition in providing innovative, viable and economically attractive bonding solutions to a continually changing marketplace.
We are also finding an ever increasing number of applications requiring bonding solutions in today's advanced product technology. Our bonding techniques continue to prove themselves highly adaptable and able to accommodate different and varied applications.
Industries and markets where our proprietary techniques are applied currently include disk drives, semiconductors, solar energy, coated glass and flat panel technology.