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Grinding Dicing Services, Inc.

Thin wafer technology increases the function density of IC packaging, enabling the development of more portable electronics.

925 Berryessa Road, San Jose, CA 95133, United States

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To achieve the desired results for your specific project, GDSI continuously researches emerging applications targeting unit cost reduction and maximum product yield. GDSI has perfected the process of mechanical stress reduction in ultra-thin wafers after a decade of R&D.

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11 - 30

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  • Location:

    Other: 925 Berryessa Road, San Jose, CA 95133, United States