The overall production process begins with a simple glass plate. Through a cyclic process, the conducting, semi-conducting, and insulating layers are built and then removed in a complex mechanism designed to create the desired circuitry of the photodiode arrays. The overall process can be simplified into three complex steps - the creation of the switch, the creation of the photodiode, and the creation of the metal lines, or “wires” that connect the photosensor array to the outside world. Each plate is initially sprayed with a form of metal before going to a photolithography step - similar to the concept of negatives used in "old fashioned" photography - in which light is shown through a specifically-designated mask (analogous to a photographic "negative"). Where the light hits the glass, the material becomes soft and is removed in a developer, or a chemical bath, that reacts to create visible differences in what layers stay and what is to be removed. The next step is the etching - in which unnecessary layers are disposed of. This cycle of depositing and removing material is repeated for multiple layers until the desired circuitry is created. Finally, the plate is coated in a passivation layer, checked for quality, and shipped to be utilized in medical, non-destructive imaging, and security settings.