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Royce Instruments, Inc.

Royce Instruments die sorters range from semi-auto table top systems to automatic pattern recognition 300mm systems with wafer map and ink-dot die selection.

831 Latour Court, Suite C, Napa, CA 94558, United States

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Our Company

Ideal for MEMS and other devices with fragile geometry.
Wafer map capabilities include multi-project wafers and industry standard wafer formats.
Royce Instruments bond testers handle a wide variety of chip and wire testing applications. Comprehensive SPC and data export capabilities

Capabilities include:
• Wire bond pull test
• Ball bond shear test
• Solder ball shear test
• Die bond shear test
• Zone shear test


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11 - 30

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  • Location:

    Other: 831 Latour Court, Suite C, Napa, CA 94558, United States