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Pac Tech USA, Inc.

PacTech GmbH, a group member of NAGASE & CO., LTD., manufactures equipment for the microelectronic & advanced packaging industry and offers wafer level bumping & packaging contract manufacturing out of Nauen, Germany

328 Martin Avenue, Santa Clara, CA 95050-3112, United States

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Our Company

The equipment product line consists of solder jetting equipment (SB2-Jet), wafer-level solder ball transfer systems (Ultra-SB2), wafer-level solder rework equipment (Ultra-SB2 300 WLR), laser assisted flip-chip bonders (Laplace) and automatic wet chemical lines for high volume electroless NiAu & NiPdAu bumping (PacLine 300 A50). The subcontractor services consist of wafer bumping with electroless Ni/Au or Ni/Pd Under Bump Metallization (UBM) for wafer level solder bumping for FC or WLCSP as well as Ni/Pd/Au for wire bonding. PAC TECH also offers AOI, X-Ray inspection, wafer-level RDL, wafer thinning, laser marking, wafer dicing, tape & reel service.


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11 - 30

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  • Location:

    Other: 328 Martin Avenue, Santa Clara, CA 95050-3112, United States