For the past half century, Teledyne Microelectronics has produced millions of microelectronic hybrids that contributed to countless hours of history. We continue to build on our rich heritage of advanced manufacturing technologies. Our microelectronics packaging experience, combined with electronic manufacturing services, provides a complete, vertically integrated advanced manufacturing solution. From printed circuit boards, to complex microelectronics, to box level assemblies, we are uniquely positioned to help you with your most complex and challenging manufacturing needs.
Our customer base, which includes the U.S. Government and prime contractors, demand uncompromising quality, reliability and delivery. Our numerous certifications including AS9100 ISO 9001, MIL-PRF-38534 Class H and K accreditation are integral factors in our company-wide initiative to deliver high-reliability microelectronic devices that meet our customer's stringent requirements. We are a DOD Trusted Source for Microelectronics Packaging, Assembly and Test.