Our goal was to incorporate capabilities and design practices of leading global production fabricators to help customers develop a transferable production design as opposed to a secular solution. This approach has enabled customers introduce products to the market much faster than before. Customers requiring prototypes or low volume gain the insight and benefits of global fabrication expertise.
As the market evolved, Altaflex embraced the changes by providing customers leading-edge capabilities and new interconnect solutions. The demand for high precision flex circuits propelled us to increase our manufacturing size from a 10,000 sq. ft. facility to two facilities totaling 22,000 sq. ft. in 2010. Seven UV Yag lasers and laser direct imaging were installed to support growth and to facilitate our goal of continuous improvement.
In early 2010, Altaflex began developing captive processes to fabricate projective capacitance touch panels. In the summer of 2011, we began shipping touch panel sub-assemblies on a quick-turn basis. This empowered customers to quickly verify touch designs, chip designs, and evaluate new materials in a matter of days versus weeks. Our goal is to enable domestic customers to have the tools necessary to make global decisions.
The combination of various fabrication proficiencies also provides our customers the opportunity to participate in the emerging printed electronics market.
Altaflex continues to invests in technology to support new and existing customers with global interconnect solutions. Our goal is to empower customers by providing a toolbox of technologies and capabilities to help develop tomorrow's products.