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Polymer Assembly Technology, Inc.

PAT specializes in prototype and low-volume flip chip assembly services for fine-pitch (75µm) pixel imaging devices and temperature sensitive II-VI and III-V group materials, including: optical, radiation, and bio-medical sensors, and optical/polymer-MEMS.

104 T.W. Alexander Drive, Bldg 7, Rm. 727, Research Triangle Park, NC 27709, United States

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Our Company

The technology utilizes low-temperature curing, silver-filled (non-leaded) conductive epoxies that are applied using a patented stencil printing technique. High density flip chip interconnections up to 8000 I/O have been achieved using low applied forces. This technique offers a less expensive and safer alternative to conventional indium bump bonding or “Hybridization” assembly. The electrically conductive and non-conductive polymer inks that are used in this process are cured at temperatures as low as 60°C and are therefore important for temperature sensitive component assembly. PAT is believed to be the only company with this area of expertise in the US. The company is presently providing custom assembly solutions for numerous government, university and private research labs that are developing optical, radiation, and bio-medical sensors, and optical/polymer-MEMS and bio-fluidic devices. PAT is registered with the DOD’s Central Contractor Registration (CCR) as a small business service provider and will provide references on request.

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11 - 30

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  • Location:

    Other: 104 T.W. Alexander Drive, Bldg 7, Rm. 727, Research Triangle Park, NC 27709, United States